This inventor holds 6 USPTO granted patents. Top assignees: Global Unichip Corporation, Sarcina Technology LLC, Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2019.
Company Filing History:
3 out of 244 
3 out of 3 
1 out of 42,711 
Years Active: 2012-2019
Title: Longqiang Zu: Innovator in Semiconductor Package Design
Introduction
Longqiang Zu is a prominent inventor based in Palo Alto, CA, known for his contributions to semiconductor package design. He holds a total of 6 patents, showcasing his expertise in optimizing package substrates for high-speed data transmission.
Latest Patents
Zu's latest patents focus on package substrate differential impedance optimization for data rates ranging from 25 to 60 Gbps and beyond. His innovative package design methods aim to enhance the performance of semiconductor chip packages, particularly for high-speed SerDes signals. The methods he developed optimize parameters of vertical interconnections, including BGA balls, vias, and PTH, while addressing the joint between vertical and horizontal interconnections of traces. His patents also include various chip package designs that utilize different BGA ball pitches and substrate configurations, all aimed at achieving low substrate differential impedance discontinuity and minimizing differential insertion loss and return loss.
Career Highlights
Throughout his career, Longqiang Zu has worked with notable companies such as Sarcina Technology LLC and Global Unichip Corporation. His experience in these organizations has allowed him to refine his skills and contribute significantly to the field of semiconductor technology.
Collaborations
Zu has collaborated with talented individuals in the industry, including Li-Chang Hsiao and Yu-Yu Lin. These partnerships have further enriched his work and led to advancements in semiconductor package design.
Conclusion
Longqiang Zu's innovative work in semiconductor package design has made a significant impact on the industry. His patents and collaborations reflect his dedication to advancing technology in high-speed data transmission.