Lohit Yerva

Title: The Innovations of Lohit Yerva

Introduction

Lohit Yerva is an accomplished inventor based in Mountain View, California. He has made significant contributions to the field of technology, particularly in the area of multi-chip devices. His innovative work has led to the development of a unique patent that enhances the functionality of logic dies in multi-chip packages.

Latest Patents

Lohit Yerva holds a patent for a "Logic die in a multi-chip package having a configurable physical interface to on-package memory." This invention provides a multi-chip device with a configurable physical interface that allows for a connection from a signal on the memory interface to be selected based on whether the logic die is mirrored or non-mirrored. This advancement is crucial for improving the efficiency and versatility of multi-chip systems.

Career Highlights

Lohit Yerva is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has positioned him at the forefront of technological advancements, contributing to the development of cutting-edge products and solutions.

Collaborations

Lohit has collaborated with talented individuals such as Narasimha Lanka and Mohammad Mamunur Rashid. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Lohit Yerva's contributions to the field of technology through his patent and work at Intel Corporation highlight his role as a significant inventor. His innovative spirit continues to drive advancements in multi-chip technology, making a lasting impact on the industry.