Mountain View, CA, United States of America

Lohit R Yerva

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.4

ph-index = 1


Company Filing History:


Years Active: 2022-2024

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2 patents (USPTO):Explore Patents

Title: Lohit R Yerva: Innovator in High Bandwidth Memory Technology

Introduction

Lohit R Yerva is a prominent inventor based in Mountain View, CA (US). He has made significant contributions to the field of high bandwidth memory technology. With a total of 2 patents, his work focuses on enhancing the performance and efficiency of memory input/output links.

Latest Patents

Lohit R Yerva's latest patents include innovative technologies aimed at improving link training and data integrity. One of his patents describes a technology that provides accurate training and per-bit deskew capability for high bandwidth memory input/output links. This system utilizes a plurality of seed values programmed into linear feedback shift registers (LFSRs) to ensure that the parity bit associated with a data word toggles during link training. Another patent outlines a device, system, and method to generate link training signals, which facilitates effective communication between memory controllers and memory devices. This technology allows for the generation of memory access commands while maintaining data validity at the memory device.

Career Highlights

Lohit R Yerva is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies in memory systems. His work has been instrumental in advancing the capabilities of high bandwidth memory, making significant impacts in the tech industry.

Collaborations

Lohit has collaborated with notable colleagues, including Narasimha R Lanka and Kuljit Singh Bains. Their combined expertise contributes to the innovative projects at Intel Corporation.

Conclusion

Lohit R Yerva is a key figure in the realm of high bandwidth memory technology, with a focus on improving link training and data integrity. His contributions through patents and collaboration with industry peers highlight his commitment to innovation in the field.

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