Singapore, Singapore

Liu Wuping

This inventor holds 2 USPTO granted patents. Top assignee: Chartered Semiconductor Manufacturing Ltd (Corporation). Active years: 2006-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liu Wuping. Retrieved from https://idiyas.com/inventor/liu-wuping

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 8.0

ph-index = 2

Forward Citations = 41(Granted Patents)


Company Filing History:


Years Active: 2006-2007

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2 patents (USPTO):Explore Patents

Title: Liu Wuping: Innovator in Semiconductor Technology

Introduction

Liu Wuping is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He has been instrumental in developing innovative solutions that enhance the efficiency and reliability of semiconductor devices. With a total of 2 patents, Liu's work has significantly impacted the field.

Latest Patents

Liu Wuping's latest patents focus on the structure and method for fabricating a bond pad structure. This invention provides an improved bond pad structure that includes a top wiring layer and a top dielectric (IMD) layer over a semiconductor structure. The process involves forming a buffer dielectric layer over the top wiring layer and the top dielectric layer. A buffer opening is created in the buffer dielectric layer, exposing a portion of the top wiring layer. A barrier layer is then formed over the buffer dielectric layer and the top wiring layer in the buffer opening. Following this, a conductive buffer layer is applied over the barrier layer, which is subsequently planarized to create a buffer pad in the buffer opening. A passivation layer is formed over the buffer pad and the buffer dielectric layer, with a bond pad opening created in the passivation layer over the buffer pad. Finally, a bond pad support layer and a bond pad layer are formed and patterned to establish a bond pad and bond pad support.

Career Highlights

Liu Wuping is currently employed at Chartered Semiconductor Manufacturing Ltd, where he continues to innovate in the semiconductor industry. His work has been pivotal in advancing the technology used in modern electronic devices.

Collaborations

Liu has collaborated with several talented individuals, including Zhang Bei Chao and Hsia Liang Choo, who is a prominent female engineer in the field. Their teamwork has fostered a creative environment that encourages innovation and problem-solving.

Conclusion

Liu Wuping's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the development of advanced semiconductor solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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