Newark Valley, NY, United States of America

Lisa Jeanine Jimarez

This inventor holds 32 USPTO granted patents, primarily in Electronic Packaging. Top assignees: International Business Machines Corporation, Other. Active years: 1996-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lisa Jeanine Jimarez. Retrieved from https://idiyas.com/inventor/lisa-jeanine-jimarez

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 75.0

Average Co-Inventor Count = 3.2

ph-index = 12

Forward Citations = 468(Granted Patents)


Location History:

  • Chandler, AZ (US) (2004)
  • Newark Valley, NY (US) (1996 - 2010)

Company Filing History:


Years Active: 1996-2010

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Areas of Expertise:
Z Interconnect Structure
Printed Wiring Board
Electronic Package
Optical Assemblies
Chip Carrier Flexing
High Performance Packaging
Conductive Bonding
Thermal Cycling
Surface Metal Balancing
Integrated Circuit Assembly
Selective Etching
32 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Lisa Jeanine Jimarez

Introduction

Lisa Jeanine Jimarez, a prominent inventor based in Newark Valley, NY, has made significant strides in the field of technology, particularly in interconnect structures and methods. With an impressive portfolio of 32 patents, Jimarez continues to push the boundaries of innovation.

Latest Patents

Among her latest patents, one notable invention is the "Z interconnect structure and method." This innovative method involves attaching multiple cores where each core has a via with a conductive surface to establish an electrical connection with another core's conductive surface. The process entails applying a metallurgical paste to a conductive surface, selectively removing part of the flux from the paste, and then joining the cores together. Furthermore, her invention also encompasses a structure that integrates several cores with a metallurgical paste that efficiently connects the via to the conductive surface on neighboring cores.

Another significant advancement is her patent on the "Method for producing Z-axis interconnection assembly of printed wiring board elements." This method outlines creating a composite wiring board member featuring a dielectric substrate. It involves applying adhesive tape to the substrate's surface, forming openings through it and the tape, and dispensing electrically conductive material into these openings. This innovative process allows for the formation of a wiring structure by creating nubs of conductive material that extend above the substrate's face to interconnect with other elements.

Career Highlights

Throughout her tenure, Jimarez has worked with prominent companies, including the International Business Machines Corporation (IBM). Her work there and elsewhere has solidified her reputation as a visionary and a skilled innovator in her field.

Collaborations

Jimarez has collaborated with several talented individuals during her career, notably Miguel Angel Jimarez and Donald Seton Farquhar. Their collaborative efforts have fostered a creative environment that has led to the development of cutting-edge technologies and solutions.

Conclusion

With a robust patent portfolio and a commitment to advancing technology, Lisa Jeanine Jimarez stands out as a leading inventor. Her innovative contributions not only enhance the field of printed wiring board elements but also inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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