Liop Jin Yap

Title: Liop Jin Yap: Innovator in Semiconductor Testing Solutions.

Introduction

Liop Jin Yap is a prominent inventor based in Singapore, known for his contributions to the field of semiconductor testing. With a total of 3 patents to his name, he has made significant advancements in the technology used for handling and testing small semiconductor devices.

Latest Patents

One of his latest patents is a Multi-package conversion kit for a pick and place handler. This invention provides a kit and method for package-to-package conversion of a pick and place handler. An input arm assembly is equipped with interchangeable vacuum leads, allowing for easy package-to-package conversion by simply replacing the vacuum lead with a different size. The design includes an input/output shuttle plate with a block and base plate, featuring multiple pocket groupings and alignment hole groupings. The base plate is designed with alignment pins to facilitate the conversion process. Additionally, a soak plate is included, which has an array of pocket groupings to accommodate various package sizes and shapes. Another notable patent involves testing BGA and other CSP packages using probing techniques. This method and apparatus enable the handling of small semiconductor devices during testing, utilizing device strip carrier alignment tools for precise positioning.

Career Highlights

Liop Jin Yap is currently employed at St Assembly Test Services Inc., where he continues to innovate in the semiconductor testing industry. His work has significantly impacted the efficiency and effectiveness of testing small semiconductor devices.

Collaborations

Throughout his career, Liop has collaborated with notable colleagues, including Chee-Keong Tan and Wee Boon Tan. Their teamwork has contributed to the development of advanced testing solutions in the semiconductor field.

Conclusion

Liop Jin Yap's innovative contributions to semiconductor testing demonstrate his expertise and commitment to advancing technology in this critical industry. His patents reflect a deep understanding of the challenges faced in semiconductor testing and offer practical solutions to enhance efficiency.