The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2001

Filed:

Oct. 30, 1998
Applicant:
Inventors:

Liop Jin Yap, Singapore, SG;

Wee Boon Tan, Singapore, SG;

Chee-Keong Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/126 ;
U.S. Cl.
CPC ...
G01R 3/126 ;
Abstract

An arrangement of three plates where the top plate interfaces with the BGA device, the center plate has a structure of channels or openings which is matched with the size and ball pitch of the BGA device that is being handled while the bottom plate interfaces with the tester or target plate. A plurality of center plates is provided to match and equal the plurality of BGA devices that is handled in the BGA testing or BGA semiconductor-manufacturing environment.


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Yap, Liop. (2001). Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system (U.S. Patent No. 6300781). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6300781

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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