Nanjing, China

Linling Li

This inventor holds 1 USPTO granted patent. Top assignees: Jiangsu Hhck Advanced Materials Co., Ltd., Nanjing University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Linling Li. Retrieved from https://idiyas.com/inventor/linling-li-ztznwfg8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Linling Li: Innovator in Metal-Resin Composites

Introduction

Linling Li is a prominent inventor based in Nanjing, China. He has made significant contributions to the field of materials science, particularly in the development of advanced composites for high-frequency and high-speed signal transmission.

Latest Patents

Linling Li holds 1 patent for his invention titled "Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission." This innovative patent describes a metal-resin composite that includes a surface-treated metal with a nano-scale pore array. The structure allows for improved bonding strength between the resin and metal substrate, enhancing the performance of printed circuit boards (PCBs) without the need for additional additives.

Career Highlights

Throughout his career, Linling Li has worked at notable institutions such as Nanjing University and Jiangsu Hhck Advanced Materials Co., Ltd. His work has focused on advancing materials that can meet the demands of modern electronic applications.

Collaborations

Linling Li has collaborated with esteemed colleagues, including Wei Chen and Qi Xue, to further his research and development efforts in the field of materials science.

Conclusion

Linling Li's innovative work in metal-resin composites positions him as a key figure in the advancement of technology for high-speed signal transmission. His contributions continue to influence the development of more efficient electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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