Nanjing University

Jiangsu Hhck Advanced Materials Co., Ltd.

Linling Li

Wei Chen

Xiaoliang Wang

Qi Xue

Dongshan Zhou

Huijie Zhuang

Jianglong Han

A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to extend from bottoms to openings of nano-scale pores of the nano-scale pore array. The pillar-in-pore structure makes a resin entering a nano-scale pore have an ultra-high anchoring effect on a resin body outside the nano-scale pore. Therefore, on the premise of not using an additive such as a T liquid or a coupling agent, the present disclosure greatly improves a tensile bonding strength at an interface between a resin body and a metal substrate, and also eliminates a decline in an interfacial bonding strength of a composite.

Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission

Growing community of inventors

Nanjing, China

Linling Li