The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Apr. 11, 2024
Nanjing University, Nanjing, CN;
Jiangsu Hhck Advanced Materials Co., Ltd., Lianyungang, CN;
Wei Chen, Nanjing, CN;
Qi Xue, Nanjing, CN;
Huijie Zhuang, Nanjing, CN;
Linling Li, Nanjing, CN;
Jianglong Han, Nanjing, CN;
Dongshan Zhou, Nanjing, CN;
Xiaoliang Wang, Nanjing, CN;
NANJING UNIVERSITY, Nanjing, CN;
JIANGSU HHCK ADVANCED MATERIALS CO., LTD., Lianyungang, CN;
Abstract
A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to extend from bottoms to openings of nano-scale pores of the nano-scale pore array. The pillar-in-pore structure makes a resin entering a nano-scale pore have an ultra-high anchoring effect on a resin body outside the nano-scale pore. Therefore, on the premise of not using an additive such as a T liquid or a coupling agent, the present disclosure greatly improves a tensile bonding strength at an interface between a resin body and a metal substrate, and also eliminates a decline in an interfacial bonding strength of a composite.