Company Filing History:
Years Active: 2022-2025
Title: Innovations of Ling-Chun Tseng
Introduction
Ling-Chun Tseng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his expertise and innovative spirit.
Latest Patents
His latest patents include a "Semiconductor memory structure and method for forming the same." This patent describes a method for forming a semiconductor memory structure that involves creating a plurality of conductive wire structures over a semiconductor substrate, along with spacer structures and dielectric strips. The process culminates in the formation of conductive pads and gaps in the spacer structures. Another patent, titled "Memory devices and methods for forming the same," details a memory device that consists of a substrate, bit line, and multiple insulating films. The design ensures that the top surfaces of the insulating films are lower than that of the first insulating film, optimizing the device's functionality.
Career Highlights
Ling-Chun Tseng is currently employed at Winbond Electronics Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing memory device designs and manufacturing methods.
Collaborations
He collaborates with talented coworkers, including Tzu-Ming Ou Yang and Hung-Jung Yan, who contribute to the innovative environment at Winbond Electronics Corporation.
Conclusion
Ling-Chun Tseng's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in the field. His work continues to influence the development of advanced memory devices.