The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Jun. 25, 2021
Winbond Electronics Corp., Taichung, TW;
Hung-Jung Yan, Tainan, TW;
Ling-Chun Tseng, Taichung, TW;
Chun-Chieh Wang, Taichung, TW;
Tzu-Ming Ou Yang, Taichung, TW;
WINBOND ELECTRONICS CORP., Taichung, TW;
Abstract
A method for forming a semiconductor memory structure includes forming a plurality of conductive wire structures over a semiconductor substrate, and forming a plurality of spacer structures along the sidewalls of the conductive wire structures. Each of the spacer structures includes a first spacer. The method also includes forming a plurality of dielectric strips across the conductive wire structures, forming a plurality of conductive strips over the conductive wire structures and the dielectric strips, performing a patterning process on the conductive strips to form a plurality of conductive pads, and removing the first spacer of each of the spacer structures to form a gap in each of the spacer structures.