The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Sep. 30, 2020
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Ling-Chun Tseng, Taichung, TW;

Shu-Ming Lee, Taichung, TW;

Tzu-Ming Ou Yang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 27/108 (2006.01); H01L 21/768 (2006.01); G11C 5/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); G11C 5/063 (2013.01); H01L 21/76814 (2013.01); H01L 27/10805 (2013.01); H01L 27/10885 (2013.01); H01L 27/10888 (2013.01);
Abstract

A memory device includes a substrate, a bit line, a first insulating film, a second insulating film, a third insulating film, and a contact. The bit line is disposed over the substrate. The first insulating film is disposed on a sidewall of the bit line. The second insulating film is disposed on the first insulating film and is made of a different material than the first insulating film. The third insulating film is disposed on the second insulating film and is made of a different material than the second insulating film. The top surfaces of the second insulating film and the third insulating film are lower than the top surface of the first insulating film. The contact is disposed over the substrate and adjacent to the bit line. The width of the lower portion of the contact is less than the width of the upper portion of the contact.


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