Linden M Boice

Title: The Innovative Contributions of Linden M. Boice

Introduction

Linden M. Boice is a notable inventor based in Boise, ID (US), recognized for his contributions to the field of printed circuit assemblies. With a total of 2 patents, Boice has made significant advancements in heat sinking technology, which is crucial for managing heat in electronic devices.

Latest Patents

Boice's latest patents focus on innovative designs for heat sinking in printed circuit assemblies. The first patent describes a printed circuit assembly that includes a printed circuit board and a heat generating component coupled to it. This design features a conductive substrate with a flexing structure and a protrusion that extends toward the printed circuit board, effectively managing heat dissipation. The second patent further refines this concept by incorporating a thermally conductive pad between the printed circuit board and the protrusion of the formed substrate, which is designed to flex and relieve stress at the attachment point of the heat generating component.

Career Highlights

Linden M. Boice is currently employed at Hewlett-Packard Development Company, L.P., where he continues to innovate in the field of electronics. His work has contributed to the development of more efficient and reliable electronic devices, showcasing his expertise in thermal management solutions.

Collaborations

Throughout his career, Boice has collaborated with talented individuals such as Clinton Troy Jensen and Dan Rothenbuhler. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Linden M. Boice's contributions to the field of printed circuit assemblies and heat sinking technology highlight his role as an influential inventor. His patents not only demonstrate his innovative spirit but also contribute to advancements in electronic device performance.