Hewlett-Packard Development Company, L.p.

Linden M Boice

Paul K Mui

Clinton Troy Jensen

Dan Rothenbuhler

Brad T Dransfield

A printed circuit assembly includes a printed circuit board, a heat generating component coupled to the printed circuit board, and a conductive substrate extending parallel to the printed circuit board. The conductive substrate includes a flexing structure and a protrusion disposed on the flexing structure. The protrusion extends toward the printed circuit board opposite the heat generating component.

Heat sinking

A printed circuit assembly includes a printed circuit board, a heat generating component attached to the printed circuit board at a first location, a formed conductive substrate including a protrusion extending toward the printed circuit board corresponding to the heat generating component, and a thermally conductive pad disposed between the printed circuit board and the protrusion of the formed substrate. The formed conductive substrate is configured to flex the protrusion to relieve stress at the heat generating component attachment.

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Boise, ID, United States of America

Linden M Boice