The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Jun. 30, 2016
Applicant:
Hewlett-packard Development Company, L.p., Fort Collins, CO (US);
Inventors:
Clinton Troy Jensen, Boise, ID (US);
Dan Rothenbuhler, Boise, ID (US);
Linden M. Boice, Boise, ID (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01); B41J 2/44 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); B41J 2/442 (2013.01); H05K 1/0204 (2013.01);
Abstract
A printed circuit assembly includes a printed circuit board, a heat generating component coupled to the printed circuit board, and a conductive substrate extending parallel to the printed circuit board. The conductive substrate includes a flexing structure and a protrusion disposed on the flexing structure. The protrusion extends toward the printed circuit board opposite the heat generating component.