This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Lin Yu-Ting: Semiconductor Packaging Inventor
Introduction
Lin Yu-Ting is an inventor associated with Hsinchu, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work addresses bump-pattern design for flip-chip semiconductor packages.
Latest Patents
The provided information lists one patent for Lin Yu-Ting: “Bump Pattern Design for Flip Chip Semiconductor Package.” The invention describes contact pads arranged on a package substrate to receive solder bumps from an attached semiconductor chip. Its layout uses central, transition, and peripheral portions, with the transition portion having a lower pattern density than the central and peripheral portions. Reduced-density outer areas, including corner sections and channels without contact pads, can help manage the pattern, while selected rows and columns may have increased spacing.
Career Highlights
Lin Yu-Ting’s listed patent reflects work on the arrangement and spacing of contacts in flip-chip semiconductor packaging. The design focuses on varying pattern density and pitch across different regions of a package substrate.
Collaborations
The provided information names Shang-Yun Hou and Hao-Yi Tsai as Lin Yu-Ting’s coworkers. It does not specify their roles in the patent or whether they collaborated on the invention.
Conclusion
Lin Yu-Ting’s recorded patent concerns a differentiated bump-pattern layout for flip-chip semiconductor packages, highlighting his contribution to semiconductor packaging design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile