This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Lin-Min Hung: Innovator in Semiconductor Technology
Introduction
Lin-Min Hung is a prominent inventor based in Longtan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that addresses critical aspects of wafer bonding processes.
Latest Patents
Lin-Min Hung holds a patent titled "Systems and methods for post-bonding wafer edge seal." This patent describes a method for fabricating a semiconductor device. In this process, a first substrate is arranged over a second substrate, and a wafer bonding process is performed. The bonding process encloses first regions of the device while leaving second regions exposed. Following the bonding, one or more processes are conducted on the exposed second regions, including a fill process that forms fill material within these areas. Finally, an edge seal material is applied to both the first and second substrates.
Career Highlights
Lin-Min Hung is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work has contributed to advancements in semiconductor device fabrication, enhancing the efficiency and reliability of these technologies.
Collaborations
Lin-Min has collaborated with notable colleagues, including Hsin-Ting Huang and Shang-Ying Tsai. Their combined expertise has fostered innovation within their projects and has led to significant advancements in semiconductor technology.
Conclusion
Lin-Min Hung's contributions to semiconductor technology through his patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor device fabrication.