Lim Yeow Kheng

Title: Lim Yeow Kheng: Innovator in Semiconductor Technology

Introduction

Lim Yeow Kheng is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. He has been instrumental in developing innovative solutions that enhance the efficiency and reliability of semiconductor devices. With a total of 2 patents to his name, Lim continues to push the boundaries of technology in his field.

Latest Patents

Lim Yeow Kheng's latest patents focus on the structure and method for fabricating a bond pad structure. This invention provides an improved bond pad structure that includes a top wiring layer and a top dielectric (IMD) layer over a semiconductor structure. The process involves forming a buffer dielectric layer over these components, creating a buffer opening that exposes a portion of the top wiring layer. A barrier layer is then formed over the buffer dielectric layer and the top wiring layer within the buffer opening. Following this, a conductive buffer layer is applied and planarized to create a buffer pad. A passivation layer is subsequently formed over the buffer pad and the buffer dielectric layer, with a bond pad opening created in the passivation layer. Finally, a bond pad support layer and a bond pad layer are formed and patterned to complete the bond pad structure.

Career Highlights

Lim Yeow Kheng has made significant strides in his career, particularly at Chartered Semiconductor Manufacturing Ltd. His work has been pivotal in advancing semiconductor manufacturing processes, contributing to the overall growth and innovation within the industry.

Collaborations

Throughout his career, Lim has collaborated with notable colleagues, including Hsia Liang Choo and Tan Juan Boon. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Lim Yeow Kheng is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the field. His innovative patents and collaborative efforts continue to shape the future of semiconductor manufacturing.