This inventor holds 1 USPTO granted patent. Top assignee: Advanpack Solutions Pte Ltd.. Active years: 2008.
Company Filing History:
Years Active: 2008
Title: Innovations of Lim Tiong Soon in Die Pillar Structures
Introduction: Lim Tiong Soon is an accomplished inventor based in Singapore, SG. He has made significant contributions to the field of die technology, particularly with his innovative designs and methods. His work has garnered attention for its potential applications in various industries.
Latest Patents: Lim Tiong Soon holds a patent for "Die pillar structures and a method of their formation." This patent describes a die that comprises a substrate and one or more pillar structures formed over the substrate in a specific pattern. The method of forming the die is also detailed in the patent, showcasing his inventive approach to die technology. He has 1 patent to his name.
Career Highlights: Lim Tiong Soon is currently employed at Advanpack Solutions Pte Ltd., where he continues to develop and refine his innovative ideas. His work at the company has positioned him as a key player in advancing die technology.
Collaborations: Lim has collaborated with notable coworkers, including Kim Hwee Tan and Ch'ng Han Shen. Their combined expertise contributes to the innovative environment at Advanpack Solutions Pte Ltd.
Conclusion: Lim Tiong Soon's contributions to die technology through his patent and work at Advanpack Solutions Pte Ltd. highlight his role as a significant inventor in the field. His innovative methods and designs pave the way for future advancements in the industry.