The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2008
Filed:
Oct. 09, 2003
Applicants:
Kim Hwee Tan, Singapore, SG;
Ch'ng Han Shen, Singapore, SG;
Rosemarie Tagapulot, Singapore, SG;
Yin Yen Bong, Melaka, MY;
MA L. Nang Htoi, Singapore, SG;
Lim Tiong Soon, Singapore, SG;
Shikui Lui, Singapore, SG;
Balasubramanian Sivagnanam, Singapore, SG;
Inventors:
Kim Hwee Tan, Singapore, SG;
Ch'ng Han Shen, Singapore, SG;
Rosemarie Tagapulot, Singapore, SG;
Yin Yen Bong, Melaka, MY;
Ma L. Nang Htoi, Singapore, SG;
Lim Tiong Soon, Singapore, SG;
Shikui Lui, Singapore, SG;
Balasubramanian Sivagnanam, Singapore, SG;
Assignee:
Advanpack Solutions Pte Ltd, Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.