Lien-Chih Chan

Title: Lien-Chih Chan: Innovator in Semiconductor Packaging

Introduction

Lien-Chih Chan is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance heat dissipation efficiency.

Latest Patents

Chan holds a patent for a semiconductor package with a heat dissipating structure. This invention features a precisely positioned heat dissipating structure on a substrate, allowing multiple solder balls to self-align with ball pads formed on the substrate. This design supports a heat sink positioned above a semiconductor chip, ensuring that the heat sink closely abuts a molding cavity during the encapsulation process. This prevents resin flash on the heat sink, allowing its surface to be directly exposed to the atmosphere, which improves heat dissipating efficiency. Additionally, the solder balls are characterized by their softness, deforming in response to pressure from the encapsulating mold, thereby protecting the substrate from damage and assuring the quality of the semiconductor package.

Career Highlights

Chan is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.

Collaborations

Some of his coworkers include Chien-Ping Huang and Chi-Chuan Wu, who contribute to the collaborative environment that fosters innovation at their company.

Conclusion

Lien-Chih Chan's contributions to semiconductor packaging demonstrate his commitment to improving technology in this critical field. His innovative patent reflects a deep understanding of the challenges in heat dissipation and showcases his ability to develop effective solutions.