The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Oct. 09, 2001
Chien-Ping Huang, Hsinchu Hsien, TW;
Chi-Chuan Wu, Taichung, TW;
Jui-Yu Chuang, Taichung, TW;
Lien-Chih Chan, Taichung, TW;
Ming-Chih Hsieh, Taipei, TW;
Abstract
A semiconductor package with a heat dissipating structure is proposed, in which the heat dissipating structure is precisely positioned on a substrate, in a manner that a plurality of solder balls self-align with ball pads formed on the substrate, and support a heat sink to be positioned above a semiconductor chip mounted on the substrate. This therefore makes the heat sink closely abut a molding cavity of an encapsulating mold in a molding process, and prevents resin flash from occurring on the heat sink, so that a surface of the heat sink can be directly exposed to the atmosphere for improving heat dissipating efficiency. Moreover, the solder balls characterized in softness deform in response to a pressure generated by the encapsulating mold during molding. Therefore, the substrate can be protected from being damaged by the pressure, and thus quality of the semiconductor package can be assured.