This inventor holds 4 USPTO granted patents and 4 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2013-2018.
Company Filing History:
Years Active: 2013-2018
Title: Innovations by Liang-Yi Hung
Introduction
Liang-Yi Hung is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic device packaging and thermal management. With a total of 4 patents to his name, his work focuses on enhancing the efficiency and effectiveness of electronic components.
Latest Patents
One of Liang-Yi Hung's latest patents is a method of fabricating a packaging substrate that includes a carrier with two carrying portions. This innovative method involves providing a carrier with two carrying portions, each having a first side and a second side. The carrying portions are bonded through their second sides, allowing for the formation of a circuit layer on the first side of each portion. After the circuit layers are formed, the two carrying portions can be separated to create two packaging substrates. This design facilitates the thinning of the circuit layers while providing sufficient strength for subsequent packaging processes. The carrying portions can be removed after packaging, reducing the thickness of the packages to meet miniaturization requirements.
Another notable patent involves an electronic device that features a thermal conductor made of silver positioned between a heat sink and an electronic element. This electronic device includes an electronic element and a heat dissipating element, which is connected through a thermal conductor. The width of the thermal conductor is smaller than that of the electronic element, and the use of silver significantly enhances the thermal conductivity, thereby improving the thermal conduction efficiency of the device.
Career Highlights
Liang-Yi Hung is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing technologies that improve the performance and reliability of electronic devices.
Collaborations
Throughout his career, Liang-Yi Hung has collaborated with talented individuals such as Wei-Chung Hsiao and Chun-Hsien Lin. These collaborations have contributed to the development of cutting-edge technologies in the electronics industry.
Conclusion
Liang-Yi Hung's contributions to the field of electronic device packaging and thermal management are noteworthy. His innovative patents reflect his commitment to enhancing the efficiency and performance of electronic components. His work continues to influence the industry positively.