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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9607923 B1

PDFFull Text
Date of Patent:
Mar. 28, 2017

Filed:

Dec. 24, 2015

Electronic device having a thermal conductor made of silver between a heat sink and an electronic element, and fabrication method thereof

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chung-Jen Hung, Taichung, TW;

Chi-An Pan, Taichung, TW;

Chi-Hsiang Hsu, Taichung, TW;

Liang-Yi Hung, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 23/3736 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01);
Abstract

An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal conductor, wherein a width of the thermal conductor is smaller than a width of the electronic element. The thermal conductor includes silver to thereby greatly increase the thermal conductivity of the thermal conductor and hence improve the thermal conduction efficiency of the electronic device.

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Hung, Chung-Jen. (2017). Electronic device having a thermal conductor made of silver between a heat sink and an electronic element, and fabrication method thereof (U.S. Patent No. 9607923). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9607923

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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