This inventor holds 1 USPTO granted patent. Top assignee: Asia Pacific Microsystems, Inc.. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Innovations of Li-Yuan Lin in Substrate Bonding Methods
Introduction
Li-Yuan Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of substrate bonding methods, showcasing his expertise through his innovative patent. His work is particularly relevant in the electronics industry, where efficient bonding techniques are crucial for device performance.
Latest Patents
Li-Yuan Lin holds a patent for a "Package structure and substrate bonding method." This patent outlines a substrate bonding method that involves several key steps. Firstly, a first substrate and a second substrate are provided, with the first substrate covered by a first Ag layer and the second substrate covered by a second Ag layer and a metallic layer that includes a first Sn layer. The bonding process is then performed by aligning the substrates and bringing the metallic layer into contact with the first Ag layer. A load is applied while heating to a predetermined temperature to form Ag3Sn intermetallic compounds. Finally, the process concludes with cooling down and removing the load to complete the bonding.
Career Highlights
Li-Yuan Lin is currently employed at Asia Pacific Microsystems, Inc., where he continues to develop innovative solutions in substrate bonding. His work has been instrumental in advancing the technology used in electronic packaging.
Collaborations
Li-Yuan Lin collaborates with talented individuals such as Hung-Lin Yin and Jerwei Hsieh, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Li-Yuan Lin's contributions to substrate bonding methods highlight his role as a key inventor in the electronics industry. His innovative patent demonstrates the importance of effective bonding techniques in enhancing device performance.