This inventor holds 3 USPTO granted patents and 7 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Li-Ling Su: Innovator in Semiconductor Manufacturing
Introduction
Li-Ling Su is a prominent inventor based in Hsinchu, Taiwan. She has made significant contributions to the field of semiconductor manufacturing. Her innovative approaches focus on enhancing interconnect structures and semiconductor designs.
Latest Patent Applications
Li-Ling Su has filed several notable patent applications. One of her latest applications is titled "INTERCONNECT STRUCTURE WITH REINFORCING SPACER AND METHOD FOR MANUFACTURING THE SAME." This application describes a method for manufacturing an interconnect structure that involves forming a first dielectric layer, creating a mask, and patterning the dielectric layer to form a trench. The process includes etching a second dielectric layer to create reinforcing spacers and forming a trench-filling element.
Another significant application is "SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF." This application outlines a semiconductor structure that includes multiple layers, such as a first dielectric layer, metal layers, and etching stop layers. The design aims to optimize the integration of vias within the semiconductor structure.
Conclusion
Li-Ling Su continues to push the boundaries of semiconductor technology through her innovative patent applications. Her work is essential for advancing manufacturing methods in the semiconductor industry.