Li Chun Liu

Title: Innovations of Inventor Li Chun Liu

Introduction

Li Chun Liu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is titled "Passivation layer for a semiconductor device and method for manufacturing the same." This invention involves a semiconductor device that includes an ultra-thick metal (UTM) structure. The device features a passivation layer that consists of a first passivation oxide, which includes an unbias film and a first bias film. The unbias film is positioned on portions of the UTM structure and on portions of the layer on which the UTM structure is formed. The first bias film is placed on the unbias film. Additionally, the passivation layer includes a second passivation oxide made up of a second bias film, which is situated on the first bias film. Furthermore, the passivation layer contains a third passivation oxide consisting of a third bias film, which is located on the second bias film.

Career Highlights

Li Chun Liu has worked with Taiwan Semiconductor Manufacturing Company Limited, where he has honed his skills and expertise in semiconductor technology. His experience in this leading company has allowed him to contribute to various innovative projects.

Collaborations

Throughout his career, Li Chun Liu has collaborated with several talented individuals, including Chun Tang Wang and Chih Hung Wang. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Li Chun Liu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative work continues to shape the future of semiconductor devices.