This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Li-Cheng Hu in Integrated Circuit Technology
Introduction
Li-Cheng Hu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology. His work focuses on enhancing the reliability and performance of integrated circuit packages.
Latest Patents
Li-Cheng Hu holds a patent for "Integrated circuit packages and methods of forming the same." This patent includes a crack stopper structure surrounding an embedded integrated circuit die, which is crucial for preventing damage. The structure consists of multiple layers separated by a fill layer, with some sublayers providing adhesion, hardness buffering, and material gradients for effective transitions between layers.
Career Highlights
Li-Cheng Hu is associated with Taiwan Semiconductor Manufacturing Co., Ltd., a leading company in the semiconductor industry. His innovative approaches have contributed to advancements in integrated circuit packaging.
Collaborations
Li-Cheng Hu has worked alongside talented colleagues, including Der-Chyang Yeh and Kuo-Chiang Ting. Their collaborative efforts have furthered research and development in the semiconductor field.
Conclusion
Li-Cheng Hu's contributions to integrated circuit technology exemplify the importance of innovation in the semiconductor industry. His patent reflects a commitment to enhancing the durability and functionality of integrated circuits.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile