This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sanechips Technology Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Leqi Li - Innovator in Chip Package Technology
Introduction
Leqi Li is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of chip packaging technology. His innovative work has led to the development of a unique patent that enhances signal transmission in electronic devices.
Latest Patents
Leqi Li holds a patent for an "Interposer with signal transmission vias and chip package structure." This invention discloses an interposer that includes at least one signal transmission via and at least one insulator isolation ring. One of the insulator isolation rings encircles one of the signal transmission vias. Additionally, the interposer features at least one reverse-biased PN junction isolation ring, which surrounds at least one of the insulator isolation rings. This reverse-biased PN junction isolation ring consists of a semiconductor ring of a first conductivity type and a semiconductor ring of a second conductivity type, with the second type connected to a bias potential. Leqi Li has 1 patent to his name.
Career Highlights
Leqi Li is currently employed at Sanechips Technology Co., Ltd. His role at the company allows him to work on cutting-edge technologies in the semiconductor industry. His expertise in chip packaging has positioned him as a valuable asset to his team.
Collaborations
Leqi Li collaborates with talented coworkers, including Yelei Xie and Jian Pang. Together, they contribute to advancements in technology and innovation within their field.
Conclusion
Leqi Li is a notable inventor whose work in chip package technology has made a significant impact. His patent for an interposer with signal transmission vias showcases his innovative approach to solving complex engineering challenges. His contributions continue to influence the semiconductor industry positively.