The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

May. 27, 2021
Applicant:

Sanechips Technology Co., Ltd., Shenzhen, CN;

Inventors:

Leqi Li, Shenzhen, CN;

Yelei Xie, Shenzhen, CN;

Jian Pang, Shenzhen, CN;

Tuobei Sun, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/58 (2013.01);
Abstract

Disclosed are an interposer and a chip package structure. The interposer may include: at least one signal transmission vias; at least one insulator isolation rings, one of said insulator isolation rings encircling one of said signal transmission vias; and at least one reverse-biased PN junction isolation rings, one of said reverse-biased PN junction isolation rings surrounding at least one of said insulator isolation rings, and the reverse-biased PN junction isolation ring including a semiconductor ring of a first conductivity type and a semiconductor ring of a second conductivity type from inside to outside, the semiconductor ring of the second conductivity type is connected to a bias potential.


Find Patent Forward Citations

Loading…