This inventor holds 1 USPTO granted patent. Top assignee: Sanechips Technology Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Yelei Xie: Innovator in Chip Package Technology
Introduction
Yelei Xie is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of chip packaging technology. His innovative work has led to the development of a unique interposer design that enhances signal transmission.
Latest Patents
Yelei Xie holds a patent for an "Interposer with signal transmission vias and chip package structure." This patent discloses an interposer that includes at least one signal transmission via and at least one insulator isolation ring. One of the insulator isolation rings encircles one of the signal transmission vias. Additionally, the interposer features at least one reverse-biased PN junction isolation ring, which surrounds at least one of the insulator isolation rings. This design incorporates a semiconductor ring of a first conductivity type and a semiconductor ring of a second conductivity type, with the second type connected to a bias potential. Yelei Xie has 1 patent to his name.
Career Highlights
Yelei Xie is currently employed at Sanechips Technology Co., Ltd. His role at the company allows him to work on cutting-edge technologies in the semiconductor industry. His expertise in chip packaging has positioned him as a valuable asset to his team.
Collaborations
Yelei collaborates with talented individuals such as Jian Pang and Tuobei Sun. Their combined efforts contribute to the advancement of innovative technologies in their field.
Conclusion
Yelei Xie's contributions to chip packaging technology exemplify his innovative spirit and dedication to advancing the industry. His work continues to influence the development of new technologies in the semiconductor sector.