Leonard Schaper

Title: Leonard Schaper: Innovator in Microelectronics

Introduction

Leonard Schaper is a notable inventor based in Fayetteville, Arkansas, known for his contributions to the field of microelectronics. With a focus on improving device packaging and signal integrity, he has made significant strides in the industry. Schaper holds 2 patents that showcase his innovative approach to microelectronic assemblies.

Latest Patents

One of Schaper's latest patents is titled "Low Noise High Thermal Conductivity Mixed Signal Package." This invention presents an improved microelectronic assembly and packaging method that includes a device package designed to house a semiconductor die or chip. The assembly features an array of passive electronic components that work in cooperation with the flip chip semiconductor die, effectively decoupling noise from input signals. Additionally, a heat spreader is strategically placed between the top surface of the semiconductor die and the package cover. This configuration reduces parasitic inductance in electrical interconnections and minimizes signal noise in mixed signal high-frequency analog to digital converters operating at clock rates above 1 GHz.

Career Highlights

Leonard Schaper is currently employed at Raytheon Company, where he continues to develop innovative solutions in microelectronics. His work has contributed to advancements in the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Schaper has collaborated with notable colleagues, including Dennis Robert Kling and Bruce William Chignola. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Leonard Schaper's contributions to microelectronics through his patents and collaborations highlight his role as a significant innovator in the field. His work continues to influence the design and functionality of electronic devices, paving the way for future advancements.