Raytheon Company

Leonard Schaper

Bruce William Chignola

Dennis Robert Kling

David J Katz

Jorge M Marcial

An improved microelectronic assembly () and packaging method includes a device package for housing a semiconductor die or chip, (), an array of passive electronic components (-) operating in cooperation with the flip chip semiconductor die () and housed inside the device package to decouple noise from input signals, and a heat spreader () disposed between a top surface of the semiconductor die () and a package cover (). The semiconductor die () is configured as a flip chip die and the device package includes a package substrate () configured as a ball grid array. The improved microelectronic device () reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate () and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

Growing community of inventors

Fayetteville, AK, United States of America

Leonard Schaper