Leo Li

Title: Leo Li and Semiconductor Packaging Innovation.

Introduction

Leo Li is an inventor based in Hsinchu, Taiwan. His patent work concerns advanced semiconductor packaging, including structures that integrate semiconductor dies and spacer dies on an interposer.

Latest Patents

The provided information lists one patent for Leo Li: “Chip-on-wafer-on-board structure using spacer die and methods of forming the same.” The disclosed structure includes an interposer with bump structures, semiconductor dies bonded to one subset of the bumps, and spacer dies bonded to another subset. A molding compound die frame surrounds the dies. The semiconductor dies contain transistors and metal interconnect structures, while the spacer dies are transistor-free. This arrangement describes an approach to semiconductor integration and packaging.

Career Highlights

Li is associated with Taiwan Semiconductor Manufacturing Company Limited. His listed patent count is 1 patent, reflecting the single patent provided in the supplied information.

Collaborations

The supplied information identifies Sheng-Kai Chang as Li’s coworker. The patent details provided do not specify the coworker’s role or confirm their participation in this invention.

Conclusion

Leo Li’s listed patent focuses on a chip-on-wafer-on-board packaging structure that uses spacer dies alongside semiconductor dies, highlighting an approach to organizing components within an interposer-based assembly.