Singapore, Singapore

Lei Zhang

USPTO Granted Patents = 11 


Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014-2025

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11 patents (USPTO):

Title: Lei Zhang - Innovator in Adhesive Bond Monitoring and Charge Loss Tracking

Introduction

Lei Zhang is a prominent inventor based in Singapore, known for his innovative contributions to technology and engineering. With a total of 11 patents to his name, he has made significant strides in the fields of adhesive bonding and charge loss tracking.

Latest Patents

One of Lei Zhang's latest patents is a transducer, device, and method for monitoring the integrity of an adhesive bond. This transducer is designed to monitor the bond between two elements by utilizing a transducing adhesive that acts both as an actuator and a sensor. The transducer includes an electrode that facilitates the conversion of electrical signals to acoustic signals and vice versa, ensuring effective monitoring of the adhesive bond's integrity.

Another notable patent involves an apparatus with a memory cell calibration mechanism. This invention relates to methods and systems for tracking charge loss in first-type cells. The apparatus is equipped with a tracking mechanism that allows for direct measurements of charge loss, enabling it to model charge loss in second-type cells with different storage densities.

Career Highlights

Throughout his career, Lei Zhang has worked with esteemed organizations such as the Agency for Science, Technology and Research and Micron Technology Incorporated. His work in these companies has contributed to advancements in technology and innovation.

Collaborations

Lei Zhang has collaborated with notable colleagues, including Kui Yao and Shuting Chen, who have contributed to his research and development efforts.

Conclusion

In summary, Lei Zhang is a distinguished inventor whose work in adhesive bond monitoring and charge loss tracking has made a significant impact in the field of technology. His innovative patents and collaborations highlight his commitment to advancing engineering solutions.

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