Shanghai, China

Lei Duan

USPTO Granted Patents = 4 

Average Co-Inventor Count = 7.1

ph-index = 3

Forward Citations = 21(Granted Patents)


Location History:

  • Songjiang, CN (2013)
  • Shanghai, CN (2014 - 2015)

Company Filing History:


Years Active: 2013-2015

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4 patents (USPTO):Explore Patents

Title: Innovations by Lei Duan: A Pioneer in Flip Chip Technology

Introduction: Lei Duan, an accomplished inventor based in Shanghai, China, has made significant contributions to the field of semiconductor technology. With a total of four patents to his name, his recent innovations focus on advanced methods for preparing semiconductor devices, particularly in flip chip technology.

Latest Patents: Lei Duan’s latest patents include two significant methodologies. The first patent, titled "Method for Preparing Semiconductor Devices Applied in Flip Chip Technology," outlines a comprehensive procedure for manufacturing semiconductor devices in a flip chip process. This method involves forming deep grooves surrounding each semiconductor chip, efficiently packaging the devices, and ensuring straightforward mounting on substrates without flipping the devices.

His second patent, "Packaging Method of Molded Wafer Level Chip Scale Package (WLCSP)," describes an innovative approach to enhance wafer-level chip scale packaging. This method enables the formation of metal bumps on chip bonding pads, along with sophisticated techniques for grinding and cutting that culminate in the separation of individual chips from the wafer.

Career Highlights: Lei Duan is currently associated with Alpha & Omega Semiconductor Corporation, a company recognized for its pioneering advancements in semiconductor innovation. Throughout his career, he has been instrumental in developing techniques that improve semiconductor packaging efficiency and performance, underscoring his stature as a leader in the field.

Collaborations: In his professional journey, Lei has worked alongside talented colleagues, including Ping Huang and Yuping Gong. Collaborating with these experts has facilitated the exchange of ideas and insights, contributing to the innovative work being pursued at Alpha & Omega Semiconductor Corporation.

Conclusion: Lei Duan's contributions to the semiconductor industry, particularly through his patented methods in flip chip technology, highlight his role as a key inventor in advancing semiconductor device capabilities. His work not only reflects his expertise but also the collaborative spirit that drives innovation within the field. Through his continued efforts, Lei Duan is poised to influence the future of semiconductor technologies significantly.

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