Singapore, Singapore

Lee Wang Lai


Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 98(Granted Patents)


Company Filing History:


Years Active: 2004-2012

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7 patents (USPTO):Explore Patents

Title: Lee Wang Lai: Innovator in Semiconductor Technology

Introduction

Lee Wang Lai is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. With a total of 7 patents to his name, he has made significant advancements in the field, particularly in the design and assembly of semiconductor devices.

Latest Patents

One of Lee's latest patents is a stacked die package for peripheral and center device pad layout. This innovative assembly method involves providing a substrate, securing a first semiconductor device on a first surface, and superimposing at least a second semiconductor device partially over the first. The design allows for an outer peripheral portion of the second semiconductor device to overhang both the first semiconductor device and the substrate. Discrete conductive elements are strategically placed between the outer peripheral portion of the second semiconductor device and a second surface of the substrate. Intermediate portions of these conductive elements pass outside of a side surface of the substrate, leading to the formation of assemblies and packaged semiconductor devices.

Career Highlights

Lee Wang Lai is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work focuses on developing advanced packaging solutions that enhance the performance and efficiency of semiconductor devices.

Collaborations

Throughout his career, Lee has collaborated with talented individuals such as Chong Chin Hui and Dalson Ye Seng Kim. These partnerships have contributed to the innovative projects and patents that define his work.

Conclusion

Lee Wang Lai's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced semiconductor solutions.

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