The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Feb. 22, 2005
Dalson YE Seng Kim, Singapore, SG;
Chong Chin Hui, Singapore, SG;
Lee Wang Lai, Singapore, SG;
Roslan Bin Said, Singapore, SG;
Dalson Ye Seng Kim, Singapore, SG;
Chong Chin Hui, Singapore, SG;
Lee Wang Lai, Singapore, SG;
Roslan Bin Said, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
An assembly method is disclosed that includes providing a substrate, securing a first semiconductor device on a first surface thereof, and superimposing at least a second semiconductor device at least partially over the first semiconductor device is disclosed. An outer peripheral portion of the second semiconductor device overhangs both the first semiconductor device and the substrate. Discrete conductive elements are placed between the outer peripheral portion of the second semiconductor device and a second surface of the substrate. Intermediate portions of the discrete conductive elements pass outside of a side surface of the substrate. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.