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Austin, TX, United States of America

Larry Zhao

USPTO Granted Patents = 7

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 100(Granted Patents)

Company Filing History:

7 out of 12,867

Advanced Micro Devices Corporation

Years Active: 2001-2008

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7 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 7381660 - Dielectric barrier layer for a copper metallization layer having a varying silicon concentration along its thickness (2008-06-03),

2. 6897144 - Cu capping layer deposition with improved integrated circuit reliability (2005-05-24),

3. 6656834 - Method of selectively alloying interconnect regions by deposition process (2003-12-02),

4. 6633085 - Method of selectively alloying interconnect regions by ion implantation (2003-10-14),

5. 6600333 - Method and test structure for characterizing sidewall damage in a semiconductor device (2003-07-29),

6. 6429128 - Method of forming nitride capped Cu lines with reduced electromigration along the Cu/nitride interface (2002-08-06),

7. 6261963 - Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices (2001-07-17),

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