Kyung Sang Lim

Title: The Innovations of Kyung Sang Lim

Introduction

Kyung Sang Lim is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique fan-out semiconductor package.

Latest Patents

Kyung Sang Lim holds a patent for a fan-out semiconductor package. This package includes a semiconductor chip that is disposed in a through-hole of a first connection member. The design also features a second connection member that is placed on the active surface of the semiconductor chip. Additionally, a plurality of dummy vias surrounding the semiconductor chip are incorporated into the first connection member. This invention showcases his expertise in semiconductor packaging technology.

Career Highlights

Kyung Sang Lim is currently employed at Samsung Electro-Mechanics Co., Ltd. His role at this leading company allows him to work on cutting-edge technologies in the semiconductor industry. His contributions have been instrumental in advancing the capabilities of semiconductor packages.

Collaborations

Throughout his career, Kyung Sang Lim has collaborated with talented individuals such as Yong Ho Baek and Moon Hee Yi. These collaborations have fostered innovation and have led to the successful development of various projects.

Conclusion

Kyung Sang Lim is a prominent figure in the semiconductor industry, known for his innovative fan-out semiconductor package. His work at Samsung Electro-Mechanics Co., Ltd. and collaborations with esteemed colleagues highlight his commitment to advancing technology. His contributions continue to shape the future of semiconductor packaging.