The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Aug. 02, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/13 (2013.01); H01L 23/5389 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1035 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A fan-out semiconductor package includes a semiconductor chip disposed in a through-hole of a first connection member having the through-hole and a second connection member disposed on an active surface of the semiconductor chip. A plurality of dummy vias surrounding the semiconductor chip are disposed in the first connection member.