The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Feb. 13, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Kwang Yun Kim, Suwon-si, KR;
Kyung Sang Lim, Suwon-si, KR;
Seung Eun Lee, Suwon-si, KR;
Yong Hoon Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2026.01); G02B 6/12 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/183 (2026.01); H05K 1/185 (2026.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); G02B 6/12004 (2013.01); H05K 1/0274 (2013.01); H05K 1/115 (2013.01); H05K 1/183 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10378 (2013.01);
Abstract
A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.
Kim, Kwang. (2026). Photonic integrated circuit embedded substrate and photonic integrated circuit package (U.S. Patent No. 12604409). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604409
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile