Kyung-Hoon Park

Title: Innovations of Kyung-Hoon Park in Semiconductor Technology

Introduction: Kyung-Hoon Park is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package that enhances manufacturing precision.

Latest Patents: Kyung-Hoon Park holds a patent for a semiconductor package, along with a fabrication method for it. This invention provides a method of manufacturing a semiconductor package that includes a through wiring with high precision and minimal process defects. The semiconductor package consists of an insulating substrate with a first and second through portion, a through wiring that penetrates the insulating substrate, and a semiconductor chip that is electrically connected to the through wiring. Additionally, it features a molding member that encapsulates the semiconductor chip and insulating substrate, as well as a re-wiring pattern layer that connects the through wiring and semiconductor chip.

Career Highlights: Kyung-Hoon Park is currently associated with Nepes Co., Ltd., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.

Collaborations: One of his notable collaborators is Yong-Tae Kwon, with whom he has worked on various projects in the semiconductor field.

Conclusion: Kyung-Hoon Park's contributions to semiconductor technology exemplify the importance of innovation in enhancing manufacturing processes. His patent reflects a commitment to precision and quality in semiconductor packaging.