Kyoung-Bok Cho

Title: Kyoung-Bok Cho: Innovator in Semiconductor Bonding Technology

Introduction

Kyoung-Bok Cho is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in bonding apparatuses. With a total of 4 patents to his name, Cho continues to push the boundaries of innovation in his industry.

Latest Patents

Among his latest patents is an apparatus designed for correcting the parallelism between a bonding head and a stage. This bonding apparatus includes a detecting unit that determines whether the bonding head and the stage are sufficiently parallel during the bonding process. The bonding head is specifically configured to bond a semiconductor chip to the package substrate. Additionally, a correcting unit adjusts either the bonding head or the stage based on the detecting unit's determination during the bonding process. Another significant patent is for a solder ball mounter, which features a stage to support a substrate, a ball placer head to provide solder balls, and a solder ball mask to align the solder balls with the substrate. The solder ball mask consists of multiple layers, each with openings of varying diameters to facilitate the alignment process.

Career Highlights

Kyoung-Bok Cho is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of bonding processes in semiconductor manufacturing.

Collaborations

Throughout his career, Cho has collaborated with talented individuals such as Hyun-Ho Kim and Young-Kyun Sun. These collaborations have contributed to the development of innovative solutions in the semiconductor field.

Conclusion

Kyoung-Bok Cho's contributions to semiconductor bonding technology highlight his role as a leading inventor in the industry. His patents reflect a commitment to innovation and excellence in technology.