Samsung Electronics Co., Ltd.

Kyoung-Bok Cho

Hyun-Ho Kim

Young-Kyun Sun

Sung-Bok Hong

Seok-Yong Lee

Jeong-Jin Lee

Yong-Dae Ha

Yo-Se Eum

Tea-Seog Um

Jae-Cheol Kim

Gil-Man Kang

A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same

An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

Solder ball mounter

An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.

In-line die attaching and curing apparatus for a multi-chip package

Growing community of inventors

Cheonan-si, South Korea

Kyoung-Bok Cho