The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Dec. 22, 2004
Hyun-ho Kim, Chungcheongnam-do, KR;
Young-kyun Sun, Chungcheongnam-do, KR;
Kyoung-bok Cho, Chungcheongnam-do, KR;
Sung-bok Hong, Chungcheongnam-do, KR;
Hyun-Ho Kim, Chungcheongnam-do, KR;
Young-Kyun Sun, Chungcheongnam-do, KR;
Kyoung-Bok Cho, Chungcheongnam-do, KR;
Sung-Bok Hong, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.