Kyosuke Kobinata

Title: Innovations by Kyosuke Kobinata

Introduction

Kyosuke Kobinata is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of device manufacturing, holding a total of 3 patents. His work focuses on advanced methods for creating package devices and laminated device wafers.

Latest Patents

One of his latest patents is a package device manufacturing method. This method involves disposing device chips on specific regions of a workpiece and supplying mold resin to higher regions. The mold resin is then processed and thinned to ensure that certain regions remain unexposed. The final step includes polishing the mold resin to create a flat surface that integrates both the resin and the workpiece. Additionally, the workpiece is divided to manufacture individual package devices. Another significant patent is the laminated device wafer forming method. This method includes a laminating step where a first device wafer and a second device wafer are adjusted in position using predetermined lines for precise alignment.

Career Highlights

Kyosuke Kobinata is currently employed at Disco Corporation, where he continues to innovate in the field of device manufacturing. His expertise and inventions have contributed to advancements in technology and manufacturing processes.

Collaborations

He has collaborated with notable coworkers such as Shunsuke Teranishi and Zhiwen Chen, enhancing the innovative capabilities of their team.

Conclusion

Kyosuke Kobinata's contributions to device manufacturing through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in technology and manufacturing processes.