The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Nov. 15, 2022
Disco Corporation, Tokyo, JP;
Kyosuke Kobinata, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A package device manufacturing method is provided. In the manufacturing method, device chips are disposed on first regions of a workpiece, and a mold resin is supplied to second regions higher than the first regions and the first regions. Further, the mold resin is processed and thinned to a thickness with which the second regions of the workpiece are not exposed, and the mold resin is polished to expose the second regions of the workpiece and form, in the workpiece, a flat surface including the mold resin and the second regions, the mold resin being disposed on the first regions. Moreover, the workpiece is divided to manufacture the individual package devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile