Kyonghwan Koh

Title: Innovations of Kyonghwan Koh

Introduction

Kyonghwan Koh is a notable inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on enhancing the functionality and efficiency of semiconductor packages.

Latest Patents

Kyonghwan Koh's latest patents include a semiconductor package featuring an electromagnetic shield structure. This innovative package consists of a substrate, a semiconductor chip, and a shield structure that includes an upper cover and a side cover. The design incorporates first and second through holes, which enhance the package's performance. Another notable patent is for a molded product for semiconductor strips and a method of manufacturing semiconductor packages. This method involves a substrate with cutting regions and a mounting region, where semiconductor chips are placed. The process also includes forming a molding member and removing dummy portions to optimize the package's design.

Career Highlights

Kyonghwan Koh is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to contribute to cutting-edge technologies in semiconductor packaging.

Collaborations

Kyonghwan Koh has collaborated with talented coworkers, including Seunghwan Kim and Yongkwan Lee. Their combined expertise has fostered innovation in their projects.

Conclusion

Kyonghwan Koh's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a significant inventor in the field. His innovative designs continue to influence the industry and pave the way for future advancements.